XZIF Interconnect Specifications

Click Here for Specification Table
Back to Transmission Line Index

XZIF (Xandex Zero Insertion Force) Interconnect

New Flex Interconnect for Highly Parallel Test

The Xandex Zero Insertion Force interconnect utilizes gold bump on flex circuits to provide a reliable, high performance electrical interconnect with low deflection force characteristics for testing semiconductor devices.Spring probe interconnects require higher and higher compression forces as pin counts increase. Because the XZIF interconnect uses lateral clamping force to make electrical contact (instead of the high vertical compression force required by spring probes) it exhibits extremely low test board deflection when compared to high compression spring probe applications with similar pin counts.

With test board deflection nearly eliminated, the XZIF interconnect enables an unprecedented level of parallelism in device test. Unlike spring probes, where contact resistance varies with compression, the XZIF interconnext provides very consistent contact resistance that is dependable over 5,000 interconnect cycles. The XZIF interconnect is also available with multiple test electronic connector options that enable its use in a wide variety of test and metrology applications. Contact a Xandex Automated Test Equipment account manager for details on how the XZIF interconnect can improve your test performance.

XZIF Interconnect Assembly with clamps for both Device Under Test board and Test Electronics board connections

XZIF Interconnect Assembly with Clamp for Device Under Test board connection and Edge Connector for Test Electronics board connection

How the XZIF Electronic Interconnect Works

Each clamp assembly contains two flex circuit assemblies that consist of coaxial ribbon cables mass terminated to a gold bumped flex circuit at each end of the cable. The two flex circuit assemblies are mounted face to face on a pair of metal plates at each end of the clamp assembly. An elastomer is installed between the metal plate and each flex circuit to provide compliance when the clamp is activated. The metal plates (and flex circuits) are aligned to each other on shafts so that each plate pair forms a clamp that opens and closes by riding on the shafts.

A pneumatic diaphragm cylinder is attached along one of the metal plates at each end of the assembly. The cylinder pushes the two plates together when it is actuated. Springs internal to the clamp open the clamp when the pneumatic cylinder is exhausted, with the help of vacuum assist drawn through the cylinder exhaust. To make electrical contact, a mating connector with a pad pattern matching the gold bump pattern on the clamp flex circuit is inserted into the clamp. The connector can be either a printed circuit board or another flex circuit assembly.

DUT Flex Board Connector

DUT Flex Board Connector os mounted with two screws and is replaceable in minutes

The inserted connector aligns to the clamp's flex circuits when slots on the connector engage shafts in the clamp assembly. When the inserted connector is seated, the clamp assembly is activated, compressing the connector between the two flex circuits in the clamp.

Specifications
Cable
Signal Ribbon Cable Type (insulator/dielectric/conductor)	32 AWG Silver-plated Copper Air dielectric ("air core") coaxial construction TPE/FEP-air/SPC
Utility Ribbon Cable Type (insulator/conductor)	30 AWG TPE/tinned copper)
Electrical
Impedance @ rise time	50 Ohm ±2.5 Ohm @ 1ns Tr
Capacitance, 22.8 cm cable assembly	<30 pF including DUT Flex
Capacitance matching, line-to-line	<5% mismatch
Isolation/Cross Talk (1 victim, 4 aggressors, 500 ps rise time)	NEXT & FEXT < 5% @ 1ns Tr
-3 dB Bandwidth	> 1 GHz
Current Rating	1A per Utility channel, 250 mA per signal channel
Mechanical and Environmental
Contact Life Cycle	> 5000 mate/demate cycles
Operating Temperature Range	< 35° C
Operating Humidity Range	< 85% RH
Cleaning Solvent	Reagent Grade IPA (99% pure alcohol)