XZIF Interconnect Specifications: 2nd Generation

XZIF Double Sided-High Density Interconnect (XZIF DS-HD)

Double Sided High Density Xandex Zero Insertion Force Interconnect (XZIF) with 4 GHz Bandwidth Performance

DS-HD Narrow

Specifications

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DUT Interconnect Sequence Flash Animation

XZIF Presentation

Compared to the first generation XZIF interconnect, the DS-HD electrical path is capable of significantly higher bandwidth and electrical performance, with double the contact durability.

The modular XZIF interconnect is customizable to fit most test requirements. It is the optimal solution for volatile or non-volatile Memory test applications, SOC test applications and is ideal for dymanic high current delivery to the DUT.

And, by changing the direction of contact force from vertical (spring probe) to horizontal (clamp), the XZIF interconnect reduces compression force on the DUT test board by nearly 90%!

Narrow XZIF Double Sided-High Density Interconnect (XZIF DS-HDn)

DHigh Density Xandex Zero Insertion Force Interconnect (XZIF) with Narrow Form Factor for High Density Memory Test Applications

Compared to the first generation XZIF flex interconnect, the DS-HDn XZIF utilizes interposer technology for higher channel density and superior DC contact resistance.

The modular XZIF interconnect is customizable to fit most test requirements. It is the optimal solution for volatile or non-volatile Memory test applications. The narrow form factor clamp is especially useful for smaller probe cards (300 + mm) or larger probe cards (440 + mm) with a large keep out area.

And, by changing the direction of contact force from vertical (spring probe) to horizontal (clamp), the XZIF interconnect reduces compression force on the DUT test board by nearly 90%!

HIGH DENSITY: >13,000 CONTACTS PER 440 MM PROBE CARD

SELF ALIGNING DUT CONNECTOR IS FIELD REPLACEABLE IN MINUTES WITH TWO SCREWS

Specifications:

High Density