XZIF (Xandex Zero Insertion Force) Interconnect

Coaxial Cable and Component Specifications

Vacuum Interface Technology

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XZIF Interconnect
Spring Probe Transmission Lines
Modular Probe Blocks
Vacuum Capability
Electrical Performance
Cabled ATE Interconnects
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XZIF (Xandex Zero Insertion Force) Interconnect

The Xandex Zero Insertion Force interconnect (XZIF) is an innovative design solutio n to the challenges of high pin count semiconductor test interfacing that reduces total interface costs.  

A radical departure from traditional spring probe compliant connections and backplane connectors, XZIF changes the direction of contact force applied at the DUT and Instrument boards.

This change in direction of contact force enables the XZIF interconnect to reduce DUT board distortion, by nearly 90% compared to a comparable spring probe array.   

XZIF Performance

The XZIF interconnect utilizes interposer technology capable of greater than 18 GHz bandwidth at -3 db attenuation to provide a tunable electrical path suitable for a wide range of device specifications.  XZIF  is also a  high density contact capable of greater than 13,000 contacts on a 440 mm probe card.  

Follow these links for more information on the unlimited potential of the XZIF Interconnect.

Introducing the XZIF Interconnect

XZIF Interconnect Specifications

Spring Probe Transmission Lines

Xandex spring probe transmission lines combine Xandex spring probe/receptacle technology and manufacturing techniques with a wide range of high speed backplane/probe electronics connectors to produce cabled digital, analog, RF and Power/Utility  transmission line solutions with unparalleled performance.   

Each design is thoroughly tested and characterized mechanically, electrically and environmentally to guarantee optimum signal integrity and fidelity in the most demanding probe environments. 100% outgoing quality inspection and test insures the superior quality and performance of every Xandex Transmission Line product.

Modular Probe Blocks

Xandex probe block assemblies incorporate Xandex spring probe transmission lines into high density spring probe arrays.   Each module consists of multiple signal (I/O) spring probe channels, each isolated by two, three or four ground pins depending on individual performance requirements. One or more test sites can be arrayed in each probe block module. Utility and power channels can be integrated with the signal probes in the same module or "ganged" into separate power/utility modules.   

Modules can be retained in a circular tower to accommodate typical wafer probe interface geometry or in a square grid suited to final test. Through the scalability inherent in this modular approach, test throughput can be customized to the device type and tester capabilities by adding or subtracting probe  modules.

Probe Spacing

The Xandex spring probe/ receptacle design provides for signal channel spacing of 2.5mm between signal channels, and ground spacing of 1.8 mm. Spring probe pins are available in multiple tip configurations.

Vacuum Capability

Xandex spring probe blocks and transmission lines can be provided with vacuum capability, enabling their use in applications where a high degree of parallelism is required and vacuum is used to compress large numbers of spring probes.

Electrical Performance

The electrical performance range of Xandex Transmission Lines and Probe Blocks is greatly influenced by the backplane / probe electronics connector. 

Depending on the connector chosen, the resulting bandwidth range of Xandex blocks is 3 GHz at -3 dB to 10 GigaHertz at -3dB. Signal to signal probe spacing of 2.5 mm is standard, with +3 å return loss (VSWR) of -10 dB @ 2.8 GHz and -10 dB @ 8.8 GHz. * RF capability is also available up to 18 GHz at -1 dB and +3 å return loss (VSWR) of -13 dB @ 20 GHz.

See the Transmission Line Specifications section for performance specifications for examples of the Xandex spring probe/receptacle combined with specific connector combinations.

*Digital specifications are for 26 gauge cable 25cm length using Xandex spring probe and receptacle.

Cabled ATE Interconnects 

Xandex Transmission Line Solutions include non-spring probe high speed signal path interconnects. Designed to provide high speed signal paths between the ATE electronics backplane and the device test interface, Xandex cabled interconnects combine performance and dependability in a scalable transmission line option that can be incorporated across multiple test platforms.  

A wide variety of high speed connector options are paired with  Xandex custom designed or off the shelf  housings to provide Gigahertz bandwidth signal interconnects that allow flexibility in board and interface design. 

Quotes and Additional Information

To submit specifications for a quote or for more information on Xandex Transmission Line options and capabilities, use our online quotation request form or contact one of our ATE Account Managers directly by email or telephone.