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When
troubleshooting inking problems, keep in mind that there are many
factors that impact your ability to achieve good results. The main
causes of inking problems can generally be categorized into one or more
of the following areas:
Ink:
related to the chemical composition, handling or storage of
wafer marking ink.
Ink Cartridge: related to the
construction and use of the ink cartridge assembly. For an instructive
video on correct DieMark Filament cartridge operation and use, click
HERE (WMV
40Mb)
Backflow
Research Statement (PDF 21Kb)
Inking Application/Materials: related
to the point at which inking occurs in the probing process (inline,
offline, post probe), wafer surface characteristics, wafer passivation type
and post probe wafer handling processes.
Probe Environment: related to the type
and condition of probing equipment used and environmental conditions in the inking
area (temperature, inking speed).
Equipment Maintenance: related to
the operating condition of inking equipment.
Equipment Setup: related to the
operation, setup and use of ink cartridges and inking hardware.
It is often difficult to determine the cause of a problem by addressing
only one of the above categories as a root cause, since each of them is
dependant on the others as components of a successful, well
administrated inking process.
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