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The following is an update to the 8103 ink ambient temperature
curing recommendations. Xandex guidelines had previously indicated a
maximum room temperature cure time of 2.25 hours for dots greater
than 25 mil (625 µm) in diameter. This guideline was developed in a
laboratory setting, by testing at ambient temperature of 70 degrees
F, single un-etched silicon wafers (no passivation) set on table
top. Hard cure was tested by applying an adhesive tape on 4 rows of
dots.
This test has shown that longer cure time is needed in all cases
to hard cure the ink dots of 25 – 40 mil in ambient conditions. Cure
time of 4 - 6 hours is required for larger dot sizes. When
developing your curing process, it is important to keep in mind that
8103 ink cures through solvent evaporation, and the actual time
required for ambient curing is affected by several factors:
Dot Size: Larger dots require longer cure
times. A 40 mil dot requires a much longer ambient cure time than a
25 mil dot.
Wafer Boats: Stacking wafers in a carrier boat would increase
cure time.
The table below summarizes the new cure time guidelines for 25-40
mil 8103 ink dots.
|
CURE TYPE |
TEMPERATURE |
CURE TIME |
RESULT |
|
Hard Cure |
Air dry,
ambient conditions, single wafer |
4-6 hours for
25-40 mil |
Ink dots would
withstand sawing / scribing conditions |
Cure time could be improved by increasing the temperature and/or
air flow during the curing process. The most dramatic reduction in
cure time was achieved by placing the wafers in a low temperature
oven. At 40°C, the cure time was reduced to less than one hour.
Increased air flow (137 CFM) across the wafer surface also had a
strong effect on the curing rate, reduced to less than 2.5 hours.
If you have questions about this update, or need guidance in
establishing or modifying your 8103 curing process, please contact
Xandex Customer Service for assistance.
06/27/2012
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